NAND BASE MCP

Overview

SkyHigh Memory S5 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.


SkyHigh Memory MCP products are available in densities ranging from 2Gb SLC NAND +2Gb LPDDR4x to 4Gb SLC NAND+4Gb LPDDR4x and offered in small JEDECcompliant 149-ball BGA packages.This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.

BENEFITS of SkyHigh MCP

Reducesystem costs and help Space Saving

Increase Performance

Reduce Power

Long-Term Support and One-Stop Shop

Product Datasheets

Documentation table
Part Number Product Status Voltage Density I/O Bus Package Dimension
SLC NAND DRAM SLC NAND DRAM NAND
S5AA2200 Under Development 1.8V 2Gb 2Gb 8 16 WBGA 149
S5AA4200 Under Development 1.8V 4Gb 2Gb 8 16 WBGA 149
S5AA4411 Under Development 1.8V 4Gb 4Gb 8 16 WBGA 149