Overview

SkyHigh Memory S6 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.

SkyHigh Memory MCP products is currently available in 8Gb SLC NAND +8Gb LPDDR4x configuration and is offered in small JEDECcompliant 149-ball BGA packages. This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.
MCP NAND Product OverviewPDF | 973 KB

NAND Base MCP Products Highlights

SLC NAND

• Densities : 8Gb IO width: x8
• Voltages : 1.8V
• Page Size : 2KB
• Reliability : 100,000 P/E Cycles 10 years (typical)
• ECC : 4bit ECC

LPDDR4x

• Densities : 8Gb IO width: x16
• Voltages : 1.8V, 1.1V
• IO : 0.6V
• Speed : 2133MHz
• Bandwith : 4266Mb

Temperature

• -40°C to +85°C
• -40°C to +105°C

Package

• 149-ball WFBGA 9.5 x 8 x 0.7 mm

Product Datasheets

Design Models