SLC : 1Gb-16Gb 3.0V [ML-3]

Overview

The SkyHigh Memory ML-3 NAND Flash family is offered in 1Gb to 16Gb densities and has an on-die ECC egine. The family offers products with 3.3V VCC and 3.3V VCCQ power supplies, and x8 I/O interface. The page size is either (2048 + 128 spare) or (4096 + 256 spare) bytes. The bytes of spare area can be used for meta data or parity bits.
The ML3 Flash family also provides enhanced security features for applications which need the highest security.

Article

A radiation induced soft error study of SkyHigh ML-3 single-level-cell (SLC) NAND flash memories was published in the Microelectronics Reliability Journal and demonstrates the excellent robustness to soft errors induced by terrestrial neutron radiation and alpha particles. To learn more about the study, please read the article ”Radiation induced soft errors in 16 nm floating gate SLC NAND flash memory”

Product Datasheets

Documentation table
Part Number Page Size Product Status Density Access Time Packaging Datasheet
S34ML16G3 2KB For New Designs, Production 16 Gb 25 ns 48-pin TSOP
S34ML08G3 4KB For New Designs, Production 8 Gb 25 ns 48-pin TSOP, 63 Ball BGA
S34ML08G3 2KB For New Designs, Production 8 Gb 25 ns 48-pin TSOP, 63 Ball BGA
S34ML04G3 4KB For New Designs, Production 4 Gb 25 ns 48-pin TSOP, 63 Ball BGA
S34ML04G3 2KB For New Designs, Production 4 Gb 25 ns 48-pin TSOP, 63 Ball BGA
S34ML02G3 2KB For New Designs, Production 2 Gb 25 ns 48-pin TSOP, 63 Ball BGA
S34ML01G3 2KB Sampling Soon 1 Gb 25 ns 48-pin TSOP, 63 Ball BGA

Temperature Range : Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive AEC-Q100 Grade 3 (-40°C to +85°C), Automotive AEC-Q100 Grade 2 (-40°C to +105°C)

Product Application Notes

Application Notes
File Title Language Size Version Last Updated
AN98544 Designing with the CypressNAND PDD for Windows®Embedded CE 6.0R2and Later English 357 KB *B 06/03/2019
Issue Date :
06/26/2012
AN98544 describes the features and parameters of the SkyHigh NAND PDD to unlock the maximum potential for SkyHigh NAND devices in Windows Embedded platforms.
AN98557 Hyperstone F2 and F3 NAND Controllers/Cypress NAND – Enhancing Power fault Tolenece English 201 KB *D 06/03/2019
Issue Date :
02/11/2013
Power fault tolerance is a requirement of any modern system using flash. It is largely accomplished by software/firmware managing the flash. This application note describes a method of connecting the flash to improve the system's power fault tolerance.
AN99200 What Types of ECC Should Be Used on Flash Memory English 317 KB *H 05/29/2019
Issue Date :
11/27/2007
AN99200 discusses the possible ECC schemes and algorithms that can be implemented in systems using SkyHigh SLC NAND flash products.
AN200602 SLC Versus MLC NAND Flash Memory English 432 KB *D 06/04/2019
Issue Date :
09/26/2013
AN200602 describes the differences between single-level cell (SLC) and multi-level cell (MLC) NAND flash memory.
AN202731 Understanding Typical and Maximum Program/Erase Performance English 351 KB *C 05/29/2019
Issue Date :
09/04/2013
This application note discusses the typical and maximum program/erase performance of SkiHigh flash memory devices.
AN203229 Programming Multiple Cypress NAND Flash DevicesforaSingle Product English 579 KB *E 05/24/2019
Issue Date :
05/22/2015
AN203229 describes the steps involved in preparing a master “golden” image that can be used to program multiple NAND devices for the same platform or product.
AN218226 SingleFlashImageforMultiple SLC NAND FlashDevices WithDifferentSizes of Spare or OOBArea English 377 KB *A 05/24/2019
Issue Date :
03/01/2017
AN218226 shows how to create a product that uses a single flash image with SLC NAND flash from multiple suppliers, where a SkyHigh flash part with 64B or 128B spare area is used with another compatible NAND flash device with a different spare area size. Required changes are shown for the general case. Modifications to the Linux MTD are provided to illustrate one of the required changes for Linux-based systems.
Migration from SkyHigh S34ML-1 to S34ML-3-2K Page SLC NAND English 204 KB *D 05/25/2021
Issue Date :
04/12/2017
AN219369 details how to migrate existing designs from SkyHigh S34ML-1 NAND flash memory (S34ML04G1) to SkyHigh S34ML-3 NAND flash memory (S34ML04G3-2K page).
Migration from SkyHigh S34ML-2 to S34ML-3-2K Page SLC NAND English 200 KB *E 05/24/2021
Issue Date :
05/22/2017
AN219610 details how to migrate existing designs from SkyHigh S34ML-2 NAND flash memory (S34ML04G2) to SkyHigh S34ML-3 NAND flash memory (S34ML04G3-2K page).
Migration from SkyHigh S34ML-1 to S34ML-3 4K Page SLC NAND English 107 KB *B 10/18/2019
Issue Date :
11/17/2017
AN222053 details how to migrate existing designs from SkyHigh S34ML-1 NAND flash memory (S34ML04G1) to SkyHigh S34ML-3 NAND flash memory (S34ML04G3-2k page).
Migration from SkyHigh S34ML-2 to S34ML-3 4K Page SLC NAND English 317 KB *B 10/18/2019
Issue Date :
11/17/2017
AN222048 details how to migrate existing designs from SkyHigh S34ML-2 NAND flash memory (S34ML04G2) to SkyHigh S34ML-3 NAND flash memory (S34ML04G3-4K page).
DataSecurity in SkyHigh S34ML-3 SLCNAND English 641 KB *B 06/19/2017
Issue Date :
06/19/2017
AN219542 summarizes the data security features in SkyHigh S34ML-3 SLC NAND flash family.
Recommended PCB Routing Guidelines for S34ML-3 SLC NAND Flash Memory English 1495 KB *A 05/02/2019
Issue Date :
05/08/2018
AN223194 provides general routing guidelines for PCBs designed with a SkyHigh S34ML SLC NAND flash memory device. This application note is intended for PCD layout designers.

Manufacturing/Assembly Application Notes

Application Notes
File Title Language Size Version Last Updated
AN98527 X-Ray Inspection Test Conditions for SkyHigh NAND Flash English 287 KB *E 08/18/2021
Issue Date :
07/11/2012
AN98527 discusses the X-ray inspection test conditions and recommendations for SkyHigh NAND Flash products that should be used to prevent damage to ICs.
AN99178 SolderMaskandTrace RecommendationsforFBGAs English 408 KB *C 06/03/2019
Issue Date :
11/14/2017
AN99178 provides recommendations for solder masks used with FBGAs and escape considerations for traces.
AN201006 Thermal Considerations and Parameters English 445 KB *D 05/29/2019
Issue Date :
04/27/2011
AN201006 discusses the thermal considerations and parameters when using SkyHigh devices in printed wiring board(PWB) geometrics.
AN201106 Long Term Storage of Packaged Semiconductor IC Products English 302 KB *C 06/04/2019
Issue Date :
09/02/2011
AN201106 Provides information on long-term storage of packaged semiconductor IC products.
AN202751 Surface Mount AssemblyRecommendations for Cypress FBGA Packages English 913 KB *C 05/31/2019
Issue Date :
06/30/2015
AN202751 provides guidelines on surface mount assembly for SkiHigh’s Fine Pitch Ball Grid Arrat(FBGA) packages, printed circuit board(PCB) design, surface mount process flow, and final joint inspection methods.